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AU5790 Single wire CAN transceiver
Product data Supersedes data of 2001 Jan 31 IC18 Data Handbook 2001 May 18
Philips Semiconductors
Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
FEATURES
* Supports in-vehicle class B multiplexing via a single bus line with
ground return
DESCRIPTION
The AU5790 is a line transceiver, primarily intended for in-vehicle multiplex applications. The device provides an interface between a CAN data link controller and a single wire physical bus line. The achievable bus speed is primarily a function of the network time constant and bit timing, e.g., up to 33.3 kbps with a network including 32 bus nodes. The AU5790 provides advanced sleep/wake-up functions to minimize power consumption when a vehicle is parked, while offering the desired control functions of the network at the same time. Fast transfer of larger blocks of data is supported using the high-speed data transmission mode.
* 33 kbps CAN bus speed with loading as per J2411 * 83 kbps high-speed transmission mode * Low RFI due to output waveshaping * Direct battery operation with protection against load dump, jump
start and transients
* Bus terminal protected against short-circuits and transients in the
automotive environment
* Built-in loss of ground protection * Thermal overload protection * Supports communication between control units even when
network in low-power state
* 70 A typical power consumption in sleep mode * 8- and 14-pin small outline packages * 8 kV ESD protection on bus and battery pins
QUICK REFERENCE DATA
SYMBOL VBAT Tamb VBATld VCANHN VT tTrN tTfN tDN IBATS PARAMETER Operating supply voltage Operating ambient temperature range Battery voltage Bus output voltage Bus input threshold Bus output delay, rising edge Bus output delay, falling edge Bus input delay Sleep mode supply current load dump; 1s 3.65 1.8 3 3 0.3 70 CONDITIONS MIN. 5.3 -40 13 TYP. MAX. 27 +125 +40 4.55 2.2 6.3 9 1 100 V C V V V s s s A UNIT
ORDERING INFORMATION
DESCRIPTION SO8: 8-pin plastic small outline package SO14: 14-pin plastic small outline package TEMPERATURE RANGE -40 C to +125 C -40 C to +125 C ORDER CODE AU5790D AU5790D14 DWG # SOT96-1 SOT108-1
2001 May 18
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853-2237 26343
Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
BLOCK DIAGRAM
BATTERY (+12V) BAT 1
VOLTAGE REFERENCE
TEMP. PROTECTION
TxD
OUTPUT BUFFER
7
CANH (BUS)
NSTB (Mode 0)
3
MODE CONTROL 6 EN (Mode 1) RT BUS RECEIVER
RxD 5
4
LOSS OF GROUND PROTECTION RTH (LOAD)
AU5790
8 GND
SL01199
Figure 1.
Block Diagram
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
SO8 PIN CONFIGURATION
SO14 PIN CONFIGURATION
TxD
1
8
GND
GND
1
14
GND
NSTB (Mode 0)
2
7
CANH (BUS)
TxD
2
13
N.C.
AU5790
EN (Mode 1) 3 6 RTH (Load) NSTB (Mode 0) 3 12 CANH (BUS)
RxD
4 SO8
5
BAT
EN (Mode 1)
4
AU5790
11
RTH (Load)
RxD
5
10
BAT
SL01198
N.C.
6
9
N.C.
GND
7 SO14
8
GND
SO8 PIN DESCRIPTION
SYMBOL TxD NSTB (Mode 0) EN (Mode 1) RxD PIN 1 2 DESCRIPTION Transmit data input: high = transmitter passive; low = transmitter active Stand-by control: high = normal and high-speed mode; low = sleep and wake-up mode Enable control: high = normal and wake-up mode; low = sleep and high-speed mode Receive data output: low = active bus condition detected; float/high = passive bus condition detected Battery supply input (12 V nom.) Switched ground pin: pulls the load to ground, except in case the module ground is disconnected Bus line transmit input/output Ground N.C. GND GND N.C. BAT RTH
(LOAD)
SL01251
SO14 PIN DESCRIPTION
SYMBOL GND TxD NSTB (Mode 0) EN (Mode 1) RxD PIN 1 2 3 Ground Transmit data input: high = transmitter passive; low = transmitter active Stand-by control: high = normal and high-speed mode; low = sleep and wake-up mode Enable control: high = normal and wake-up mode; low = sleep and high-speed mode Receive data output: low = active bus condition detected; float/high = passive bus condition detected No connection Ground Ground No connection Battery supply input (12 V nom.) Switched ground pin: pulls the load to ground, except in case the module ground is disconnected Bus line transmit input/output No connection Ground DESCRIPTION
3 4
BAT RTH (LOAD) CANH (BUS) GND
5 6
4 5
7 8
6 7 8 9 10 11
CANH
(BUS)
12 13 14
N.C. GND
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
FUNCTIONAL DESCRIPTION
The AU5790 is an integrated line transceiver IC that interfaces a CAN protocol controller to the vehicle's multiplexed bus line. It is primarily intended for automotive "Class B" multiplexing applications in passenger cars using a single wire bus line with ground return. The achievable bit rate is primarily a function of the network time constant and the bit timing parameters. For example, the maximum bus speed is 33 kpbs with bus loading as specified in J2411 for a full 32 node bus, while 41.6 kbps at is possible with modified bus loading. The AU5790 also supports low-power sleep mode to help meet ignition-off current draw requirements. The protocol controller feeds the transmit data stream to the transceiver's TxD input. The AU5790 transceiver converts the TxD data input to a bus signal with controlled slew rate and waveshaping to minimize emissions. The bus output signal is transmitted via the CANH in/output, connected to the physical bus line. If TxD is low, then a typical voltage of 4 V is output at the CANH pin. If TxD is high then the CANH output is pulled passive low via the local bus load resistance RT. To provide protection against a disconnection of the module ground, the resistor RT is connected to the RTH pin of the AU5790. By providing this switched ground pin, no current can flow from the floating module ground to the bus. The bus receiver detects the data stream on the bus line. The data signal is output at the RxD pin being connected to a CAN controller. The AU5790 provides appropriate filtering to ensure low susceptibility against electromagnetic interference. Further enhancement is possible with applying an external capacitor between CANH and ground potential. The device features low bus output leakage current at power supply failure situations. If the NSTB and EN control inputs are pulled low or floating, the AU5790 enters a low-power or "sleep" mode. This mode is dedicated to minimizing ignition-off current drain, to enhance system efficiency. In sleep mode, the bus transmit function is disabled, e.g. the CANH output is inactive even when TxD is pulled low. An internal network active detector monitors the bus for any occurrence
of signal edges on the bus line. If such edges are detected, this will be signalled to the CAN controller via the RxD output. Normal transmission mode will be entered again upon a high level being applied to the NSTB and EN control inputs. These signals are typically being provided by a controller device. Sleeping bus nodes will generally ignore normal communication on the bus. They should be activated using the dedicated wake-up mode. When NSTB is low and EN is high the AU5790 enters wake-up mode i.e. it sends data with an increased signal level. This will result in an activation of other bus nodes being attached to the network. The AU5790 also provides a high-speed transmission mode supporting bit rates up to 100 kbps. If the NSTB input is pulled high and the EN input is low, then the internal waveshaping function is disabled, i.e. the bus driver is turned on and off as fast as possible to support high-speed transmission of data. Consequently, the EMC performance is degraded in this mode compared to the normal transmission mode. In high-speed transmission mode the AU5790 supports the same bus signal level as specified for the CANH output in normal mode. The AU5790 features special robustness at its BAT and CANH pins. Hence the device is well suited for applications in the automotive environment. The BAT input is protected against 40 V load dump and jump start condition. The CANH output is protected against wiring fault conditions, e.g., short circuit to ground or battery voltage, as well as typical automotive transients. In addition, an over-temperature shutdown function with hysteresis is incorporated protecting the device under system fault conditions. In case of the chip temperature reaching the trip point, the AU5790 will latch-off the transmit function. The transmit function is available again after a small decrease of the chip temperature. The AU5790 contains a power-on reset circuit. For Vbat < 2.5 V, the CANH output drive will be turned off, the output will be passive, and RxD will be high. For 2.5 V < Vbat < 5.3 V, the CANH output drive may operate normally or be turned off.
Table 1. Control Input Summary
NSTB 0 0 1 1 EN 0 1 0 1 TxD Don't Care Tx-data Tx-data Tx-data Sleep mode Wake-up transmission mode High-speed transmission mode Normal transmission mode Description 0V 0 V, 12 V 0 V, 4 V 0 V, 4 V CANH RxD float (high) bus state1 bus state1 bus state1
NOTE: 1. RxD outputs the bus state. If the bus level is below the receiver threshold (i.e., all transmitters passive), then RxD will be floating (i.e., high, considering external pull-up resistance). Otherwise, if the bus level is above the receiver threshold (i.e., at least one transmitter is active), then RxD will be low.
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
ABSOLUTE MAXIMUM RATINGS
According to the IEC 134 Absolute Maximum System: operation is not guaranteed under these conditions; all voltages are referenced to pin 8 (GND); positive currents flow into the IC, unless otherwise specified. SYMBOL VBAT VBATld VBATtr2 Supply voltage Short-term supply voltage Transient supply voltage PARAMETER Steady state Load dump; ISO7637/1 test pulse 5 (SAE J1113, test pulse 5), T < 1s ISO 7637/1 test pulse 2 (SAE J1113, test pulse 2), with series diode and bypass cap of 100 nF between BAT and GND pins, Note 2. ISO 7637/1 pulses 3a and 3b (SAE J1113 test pulse 3a and 3b), Note 2. VBAT > 2 V VBAT < 2 V ISO 7637/1 test pulse 1, Notes 1 and 2 ISO 7637/1 test pulse 2, Notes 1 and 2 ISO 7637/1 test pulses 3a, 3b, Notes 1 and 2 VBAT > 2 V, voltage applied to pin RTH via a 2 k series resistor VBAT < 2 V, voltage applied to pin RTH via a 2 k series resistor -150 -10 -16 -0.3 Direct contact discharge, R=1.5 k, C=100 pF Direct contact discharge, R=1.5 k, C=100 pF Direct contact discharge, R=1.5 k + 3 k, C=100 pF Direct contact discharge, R=1.5 k , C=100 pF -8 -8 -8 -2 2 -40 -40 -40 +125 +150 +150 -150 CONDITIONS MIN. -0.3 MAX. +27 +40 +100 UNIT V V V
VBATtr3
Transient supply voltage
+100
V
VCANH_1
CANH voltage CANH voltage Transient bus voltage Transient bus voltage Transient bus voltage Pin RTH voltage Pin RTH voltage DC voltage on pins TxD, EN, RxD, NSTB ESD capability of pin BAT ESD capability of pin CANH ESD capability of pin RTH ESD capability of pins TxD, NSTB, EN, RxD, and RTH Bus load resistance RT being connected to pin RTH Operating ambient temperature Storage temperature Junction temperature
-10 -16 -100
+18 +18
V V V
VCANH_0
VCANHtr1 VCANHtr2 VCANHtr3 VRTH1 VRTH0 VI ESDBAHB ESDCHHB ESDRTHB ESDLGHB RTmin Tamb Tstg Tvj
+100 +100 +18 +18 +7 +8 +8 +8 +2
V V V V V kV kV kV kV k
C
C C
NOTES: 1. Test pulses are coupled to CANH through a series capacitance of 1 nF. 2. Rise time for test pulse 1: tr < 1 s; pulse 2: tr < 100 ns; pulses 3a/3b: tr < 5 ns.
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
DC CHARACTERISTICS
-40 C < Tamb < +125 C; 5.5 V < VBAT < 16 V; -0.3 V < VTxD < 5.5 V; -0.3 V < VNSTB < 5.5 V; -0.3 V < VEN < 5.5 V; -0.3 V < VRxD < 5.5 V; -1 V < VCANH < +16 V; bus load resistor at pin RTH: 2 k < RT < 9.2 k; total bus load resistance 270 < RL < 9.2 k; CL < 13.7 nF; 1s < RL CL < 4s; RxD pull-up resistor 2.2 k < Rd < 3.0 k; RxD: loaded with CLR < 30pF to GND; all voltages are referenced to pin 8 (GND); positive currents flow into the IC; typical values reflect the approximate average value at VBAT = 13 V and Tamb = 25 C, unless otherwise specified. SYMBOL Pin BAT VBAT VBATL VBATLO IBATPN IBATPW IBATPH IBATN Operating supply voltage Low battery state Supply undervoltage lockout state Passive state supply current in normal mode Passive state supply current in wake-up mode Passive state supply current in high speed mode Active state supply current in normal mode Active state supply current in wake-up mode Note 1 Part functional or in undervoltage lockout state TxD = 1 or 0; check CANH and RxD are floating NSTB = 5 V, EN = 5 V, TxD = 5 V NSTB = 0 V, EN = 5 V, TxD = 5 V, Note 2 NSTB = 5 V, EN = 0 V, TxD = 5 V, Note 2 NSTB = 5 V, EN = 5 V, TxD = 0 V, RL = 270 , Tamb = 125 C Tamb = 25 C, -40 C IBATW NSTB = 0 V, EN = 5 V, TxD = 0 V, RL = 270 , Note 2, Tamb = 125 C Tamb = 25 C, -40 C, Note 2 IBATH Active state supply current in high speed mode NSTB = 5 V, EN = 0 V, TxD = 0 V, RL = 100 , Note 2, Tamb = 125 C Tamb = 25 C, -40 C, Note 2 IBATS Sleep mode supply current NSTB = 0 V, EN = 0 V, TxD = 5 V, RxD = 5 V, -1 V < VCANH < +1 V, 5.5 V < VBAT < 14 V -40 C < Tj < 125 C NSTB = 5 V, EN = 5 V, RL > 270; 5.5 V < VBAT < 27 V NSTB = 0 V, EN = 5 V, RL > 270; 11.3 V < VBAT < 16 V NSTB = 0 V, EN = 5 V, RL > 270; 5.5 V < VBAT < 11.3 V NSTB = 5 V, EN = 0 V, RL > 100; 8 V < VBAT < 16 V Recessive state or sleep mode, VCANH = -1 V; 0 V < VBAT < 27 V Recessive state or sleep mode, VCANH = 10 V; 0 V < VBAT < 16 V TxD = 0 V, normal mode, high-speed mode and sleep mode; VCANH = 10 V; 0 V < VBAT < 16 V VCANH = -1 V, TxD = 0 V; NSTB = 5 V; EN = 5 V VCANH = -1 V, TxD = 0 V; NSTB = 0 V; EN = 5 V 3.65 9.80 VBAT - 1.45 3.65 -10 -20 -20 70 5.3 2.5 13 27 5.3 2.5 2 3 4 35 40 70 V V V mA mA mA mA mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
90 70
mA mA
85 100
mA A
Pin CANH VCANHN VCANHW VCANHWL VCANHH ICANHRR ICANHRD ICANHDD Bus output voltage in normal mode Bus output voltage in wake-up mode Bus output voltage in wake-up mode, low battery Bus output voltage in high-speed transmission mode Recessive state output current, bus recessive Recessive state output current, bus dominant Dominant state output current, bus dominant 4.1 4.55 min (VBAT, 13) VBAT 4.55 10 100 100 V V V V A A A
-ICANH_N -ICANHW
Bus short circuit current, normal mode Bus short circuit current, wake-up mode
30 60
150 190
mA mA
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
SYMBOL Pin CANH (continued) -ICANHH
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Bus short circuit current in high-speed mode Bus leakage current at loss of ground (I_CAN_LG = I_CANH + I_RTH) Thermal shutdown Thermal shutdown hysteresis Bus input threshold Bus input threshold, low battery Bus input threshold in sleep mode Bus input threshold in sleep mode, low battery Voltage on switched ground pin Voltage on switched ground pin High level input voltage Low level input voltage Input current TxD input threshold TxD low level input current in normal mode TxD high level input current in sleep mode RxD low level output voltage RxD low level output current RxD high level leakage
VCANH = -1 V, TxD = 0 V; NSTB = 5 V; EN = 0 V; 8 V < VBAT < 16 V 0 V < VBAT < 16 V; see Figure 3 in the test circuits section Note 2 Note 2 5.8 V < VBAT < 27 V, all modes except sleep mode 5.5 V < VBAT < 5.8 V, all modes except sleep mode NSTB = 0 V, EN = 0 V, VBAT > 11.3 V NSTB = 0 V, EN = 0 V, 5.5 V < VBAT < 11.3 V IRTH = 1 mA IRTH = 6 mA 5.5 V < VBAT < 27 V 5.5 V < VBAT < 27 V Vi = 1 V and Vi = 5 V 5.5 V < VBAT < 27 V NSTB = 5 V, EN = 5 V, VTxD = 0 V NSTB = 0 V, EN = 0 V, VTxD = 5 V
50
190
mA
ICANLG
-50
50
A
Tsd Thys VT VTL VTS VTSL Pin RTH VRTH1 VRTH2 Pins NSTB, EN Vih Vil Ii Pin TxD Vitxd -Iiltxd -Iihtxd Pin RxD Volrxd Iolrxd Iohrxd
155 5 1.8 1.5 6.15 VBAT - 4.3
190 15 2.2 2.2 8.1 VBAT - 3.25
C C V V V V
0.1 1 3 1 15 1 50 -5 50 3 180 10
V V V V A V A A
IRxD = 2.2 mA; VCANH = 10 V, all modes VRxD = 5 V; VCANH = 10 V VRxD = 5 V; VCANH = 0 V, all modes 3 -10
0.45 35 +10
V mA A
NOTES: 1. Operation at battery voltages down to 5.3 volts is guaranteed by design. Operation higher than 18 volts (18 V < VBAT < 27 V) for up to two minutes is permitted if the thermal design of the board prevents reaching the thermal protection temperature limit, Tsd, otherwise the device will self protect. Typically these requirements will be encountered during jump start operation at Tamb 85 C and VBAT < 27 V. Refer to the "Thermal Characteristics" section of this data sheet, or application note AN2005 for guidance. 2. This parameter is characterized but not subject to production test.
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
Dynamic (AC) CHARACTERISTICS for 33 kbps operation
-40 C < Tamb < +125 C; 5.5 V < VBAT < 16 V; -0.3 V < VTxD < 5.5 V; -0.3 V < VNSTB < 5.5 V; -0.3 V < VEN < 5.5 V; -0.3 V < VRxD < 5.5 V; -1 V < VCANH < +16 V; bus load resistor at pin RTH: 2 k < RT < 9.2 k; total bus load resistance 270 < RL < 9.2 k; CL < 13.7 nF; 1s < RL CL < 4s; RxD pull-up resistor 2.2 k < Rd < 3.0 k; RxD: loaded with CLR < 30pF to GND; all voltages are referenced to pin 8 (GND); positive currents flow into the IC; typical values reflect the approximate average value at VBAT = 13 V and Tamb = 25 C, unless otherwise specified. SYMBOL Pin CANH VdBAMN CANH harmonic content in normal mode NSTB = 5 V, EN = 5 V; RL = 270 , CL = 15 nF; fTxD = 20 kHz, 50% duty cycle; 8 V < VBAT< 16 V; 0.53 MHz < f < 1.7 MHz, Note 2 NSTB = 5 V, EN = 0 V; RL = 270 , CL = 15 nF; fTxD = 20 kHz, 50% duty cycle; 8 V < VBAT< 16 V; 0.53 MHz < f < 1.7 MHz, Note 2 70 dBV PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
VdBAMW
CANH harmonic content in wake-up mode
80
dBV
Pins NSTB, EN tNH tHN tWN tNS tSN Pin TxD tTrN Transmit delay in normal mode, bus rising edge NSTB = 5 V, EN = 5 V; RL = 270 , CL = 15 nF; 5.5 V < VBAT < 27 V; measured from the falling edge on TxD to VCANH = 3.0 V NSTB = 5 V, EN = 5 V; RL = 270 , CL = 15 nF; 5.5 V < VBAT< 27 V; measured from the rising edge on TxD to VCANH = 1.0 V NSTB = 0 V, EN = 5 V; RL = 270 , CL = 15 nF; 5.5 V < VBAT < 27 V; measured from the falling edge on TxD to VCANH = 3.0 V NSTB = 0 V, EN = 5 V; RL = 270 , CL = 15 nF; 11.3 V < VBAT < 27 V; measured from the falling edge on TxD to VCANH = 8.9 V NSTB = 0 V, EN = 5 V; RL = 270 , CL = 13.3 nF; 5.5 V < VBAT < 27 V; measured from the rising edge on TxD to VCANH = 1 V, Note 2 NSTB = 0 V, EN = 5 V; RL = 270 , CL = 15 nF; 5.5 V < VBAT < 27 V; measured from the rising edge on TxD to VCANH = 1 V 3 6.3 s Normal mode to high-speed mode delay High-speed mode to normal mode delay Wake-up mode to normal mode delay Normal mode to sleep mode delay Sleep mode to normal mode delay 8 V < VBAT < 16 V 30 30 30 500 50 s s s s s
tTfN
Transmit delay in normal mode, bus falling edge
3
9
s
tTrW
Transmit delay in wake-up mode, bus rising edge to normal levels
3
6.3
s
tTrW-S
Transmit delay in wake-up mode, bus rising edge to wake-up level
3
18
s
tTfW-3.6
Transmit delay in wake-up mode, bus falling edge with 3.6 s time constant
3
12.7
s
tTfW-4.0
Transmit delay in wake-up mode, bus falling edge with 4.0 s time constant
3
13.7
s
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
SYMBOL Pin TxD (continued) tTrHS
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT s
Transmit delay in high-speed mode, bus rising edge
NSTB = 5 V, EN = 0 V; RL = 100 , CL = 15 nF; 8 V < VBAT < 16 V; measured from the falling edge on TxD to VCANH = 3.0 V NSTB = 5 V, EN = 0 V; RL = 100 , CL = 15 nF; 8 V < VBAT < 16 V; measured from the rising edge on TxD to VCANH = 1.0 V NSTB = 5 V, EN = 5 V; 5.5 V < VBAT < 27 V; CANH to RxD time measured from VCANH = 2.0 V to VRxD = 2.5 V NSTB = 0 V, EN = 5 V; 5.5 V < VBAT < 27 V; CANH to RxD time measured from VCANH = 2.0 V to VRxD = 2.5 V NSTB = 5 V, EN = 0 V; 8 V < VBAT < 16 V; CANH to RxD time measured from VCANH = 2.0 V to VRxD = 2.5 V NSTB = 0 V, EN = 0 V; CANH to RxD time, measured from VCANH = min {(VBAT - 3.78 V), 7.13 V} to VRxD = 2.5 V
0.1
1.5
tTfHS
Transmit delay in high-speed mode, bus falling edge
0.2
3
s
Pin RxD tDN Receive delay in normal mode, bus rising and falling edge 0.3 1 s
tDW
Receive delay in wake-up mode, bus rising and falling edge
0.3
1
s
tDHS
Receive delay in high-speed mode, bus rising and falling edge
0.3
1
s
tDS
Receive delay in sleep mode, bus rising edge
10
70
s
NOTES: 1. Operation at battery voltages down to 5.3 volts is guaranteed by design. Operation higher than 18 volts (18 V < VBAT < 27 V) for up to two minutes is permitted if the thermal design of the board prevents reaching the thermal protection temperature limit, Tsd, otherwise the device will self protect. Typically these requirements will be encountered during jump start operation at Tamb 85 C and VBAT < 27 V. Refer to the "Thermal Characteristics" section of this data sheet, or application note AN2005 for guidance. 2. This parameter is characterized but not subject to production test.
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
TxD 50%
tTr CANH
tTf
3V 2V 1V
RxD
tD
tD
50%
SL01255
NOTE: 1. When AU5790 is in normal, high-speed, or wake-up mode, the transmit delay in rising edge tTr may be expressed as tTrN, tTrHS, or tTrW, respectively; the transmit delay in falling edge tTf may be expressed as tTfN, tTfHS, or tTfW, respectively; and the receive delay tD as tDN, tDHS, or tDW, respectively. Figure 2. Timing Diagrams: Pin TxD, CANH, and RxD
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
TEST CIRCUITS
5.1V
TxD S1 NSTB EN S2 RxD
GND CANH
AU5790
RTH BAT 9.1 k
1.5 k
1 F
S3 I_CAN_LG 2.4 k VBAT
SL01234
Figure 3.
Loss of ground test circuit
NOTES: Opening S3 simulates loss of module ground. Check I_CAN_LG with the following switch positions to simulate loss of ground in all modes: 1. S1 = open = S2 2. S1 = open, S2 = closed 3. S1 = closed, S2 = open 4. S1 = closed = S2
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
APPLICATION INFORMATION
The information in this section is not part of the IC specification, but is presented for information purposes only. Additional information on single wire CAN networks, application circuits, and thermal management are included in application note AN2005.
CAN CONTROLLER (e.g. SJA1000)
TX0
RX0
PORT
PORT
RD +5V 2.4 to 2.7k TxD RxD NSTB EN BAT 100 nF GND 1 to 4.7 F 1N5060 or equiv. +12V
AU5790
TRANSCEIVER RTH 9.1k, 1% RT CANH
L
47 H CL 10% 220 pF
CAN BUS LINE
Note 1 Note 2
TX0 should be configured to push-pull operation, active low; e.g., Output Control Register = 1E hex. Recommended range for the load resistor is 3k < RT < 11k.
SL01200
Figure 4.
Application circuit example for the AU5790
AU5790 transceivers may require additional PCB surface at ground pin(s) as heat conductor(s) in order to meet thermal requirements. See thermal characteristics section for details.
Table 2. Maximum CAN Bit Rate
MODE Normal transmission High-speed transmission Sample point as % of bit time Bus Time constant, normal mode MAXIMUM BIT RATE AT 0.35% CLOCK ACCURACY 33.3 kbps 83.3 kbps 85% 1.0 to 4.0 s
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
THERMAL CHARACTERISTICS
The AU5790 provides protection from thermal overload. When the IC junction temperature reaches the threshold (155 C), the AU5790 will disable the transmitter drivers, reducing power dissipation to protect the device. The transmit function will become available again after the junction temperature drops. The thermal shutdown hysteresis is about 5 C. In order to avoid this transmit function shutdown, care must be taken to not overheat the IC during application. The relationships between junction temperature, ambient temperature, dissipated power, and thermal resistance can be expressed as:
Tj =Ta + Pd * ja where: Tj is junction temperature (C); Ta is ambient temperature (C); Pd is dissipated power (W); ja is thermal resistance (C/W). Thermal Resistance Thermal resistance is the ability of a packaged IC to dissipate heat to its environment. In semiconductor applications, it is highly dependant on the IC package, PCBs, and airflow. Thermal resistance also varies slightly with input power, the difference between ambient and junction temperatures, and soldering material. Figures 5 and 6 show the thermal resistance as the function of the IC package and the PCB configuration, assuming no airflow.
200
Thermal resistance (C/W)
150
very low conductance board low conductance board high conductance board
100
50
0 0 50 100 150 200 250
Cu area on fused pins (mm2)
SL01249
Figure 5.
SO-8 Thermal Resistance vs. PCB Configuration, Note 1, 2, 3
150
Thermal resistance (C/W)
very low conductance board 100 low conductance board high conductance board
50
0 0 100 200 300 400 500
Cu area on fused pins (mm2)
SL01250
Figure 6.
SO-14 Thermal Resistance vs. PCB Configuration, Note 1, 2, 3
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Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
Table 3 shows the maximum power dissipation of an AU5790 without tripping the thermal overload protection, for specified combinations of package, board configuration, and ambient temperature.
Table 3. Maximum power dissipation
JA Thermal Resistance K/W 103 82 163 119 194 135 63 50 Ta= 85 C mW 631 793 399 546 335 481 1032 1300 Ptot Power Dissipation Max. Additional Foil Area for Heat Dissipation Normal traces 225 Sq. mm of copper foil attached to pin 8. Normal traces 225 Sq. mm of copper attached to pin 8. Normal traces 225 Sq. mm of copper attached to pin 8. Normal traces 105 Sq. mm of copper attached to each of pins 1, 7, 8, & 14. Normal traces 105 Sq. mm of copper attached to each of pins 1, 7, 8, & 14. Normal traces 105 Sq. mm of copper attached to each of pins 1, 7, 8, & 14. Ta= 125 C mW 243 305 153 210 129 185 397 500
Board Type SO-8 on High Conductance Board
SO-8 on Low Conductance Board
SO-8 on Very Low Conductance Board
SO-14 on High Conductance Board
SO-14 on Low Conductance Board
103 70
631 929
243 357
SO-14 on Very Low Conductance Board
126 82
516 793
198 305
NOTES: 1. The High Conductance board is based on modeling done to EIA/JEDEC Standard JESD51-7. The board emulated contains two one ounce thick copper ground planes, and top surface copper conductor traces of two ounce (0.071 mm thickness of copper). 2. The Low Conductance board is based on modeling done to EIA/JEDEC Standard EIA/JESD51-3. The board does not contain any ground planes, and the top surface copper conductor traces of two ounce (0.071 mm thickness of copper). 3. The Very Low Conductance board is based on the EIA/JESD51-3, however the thickness of the surface conductors has been reduced to 0.035 mm (also referred to as 1.0 Ounce copper). 4. The above mentioned JEDEC specifications are available from: http://www.jedec.org/
2001 May 18
15
Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
Power Dissipation Power dissipation of an IC is the major factor determining junction temperature. AU5790 power dissipation in active and passive states are different. The average power dissipation is: Ptot = PINT*Dy + PPNINT * (1-Dy) where: Ptot is total dissipation power; PINT is dissipation power in an active state; PPNINT is dissipation power in a passive state; Dy is duty cycle, which is the percentage of time that TxD is in an active state during any given time duration. At passive state there is no current going into the load. So all of the supply current is dissipated inside the IC. PPNINT = VBAT * IBATPN where: VBAT is the battery voltage; IBATPN is the passive state supply current in normal mode. In an active state, part of the supply current goes to the load, and only part of the supply current dissipates inside the IC, causing an incremental increase in junction temperature. PINT = PBATAN - PLOADN where: PBATAN is active state battery supply power in normal mode; PBATAN = VBAT * IBATAN PLOADN is load power consumption in normal mode. PLOADN = VCANHN * ILOADN where: IBATAN is active state supply current in normal mode; VCANHN is bus output voltage in normal mode; ILOADN is current going through load in normal mode.
ILOAD = VCANHN/RLOAD IBATN = ILOAD + IINT where: IINT is an active state current dissipated within the IC in normal mode. IINT will decrease slightly when the node number decreases. To simplify this analysis, we will assume IINT is fixed. IINT = IBATN (32 nodes) - ILOAD (32 nodes) IBATN (32 nodes) may be found in the DC Characteristics table. A power dissipation example follows. The assumed values are chosen from specification and typical applications. Assumptions: VBAT = 13.4 V RT = 9.1 k 32 nodes IBATPN = 2 mA IBATN (32 nodes) = 35 mA VCANHN = 4.55 V Duty cycle = 50% Computations: RLOAD = 9.1 k / 32 = 284.4 PPNINT = 13.4 V x 2 mA = 26.8 mW ILOAD = 4.55 V / 284.4 = 16mA PLOADN = 4.55 V x 16 mA = 72.8 mW IINT = 35 mA - 16 mA = 19 mA PBATAN = 13.4 V x 35 mA = 469 mW PINT = 469 mW - 72.8 mW = 396.2 mW Ptot = 396.2 mW x 50% + 26.8 mW x (1-50%) = 211.5 mW Additional examples with various node counts are shown in Table 4.
Table 4. Representative Power Dissipation Analyses
Nodes 2 10 20 32 2 10 20 32 RLOAD () 4550 910 455 284.4 4550 910 455 284.4 VBAT (V) 13.4 13.4 13.4 13.4 26.5 26.5 26.5 26.5 IBATPN (mA) 2 2 2 2 2 2 2 2 PPNINT (mW) 26.8 26.8 26.8 26.8 53 53 53 53 VCANHN (V) 4.55 4.55 4.55 4.55 4.55 4.55 4.55 4.55 ILOAD (mA) 1 5 10 16 1 5 10 16 IBATN (mA) 20 24 29 35 20 24 29 35 IINT (mA) 19 19 19 19 19 19 19 19 PINT (mW) 263.5 298.9 343.1 396.2 525.5 613.3 723 854.7 Dcycle 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 Ptot (mW) 145.1 162.8 184.9 211.5 289.2 333.1 388 453.8
By knowing the maximum power dissipation, and the operation ambient temperature, the required thermal resistance without tripping the thermal protection can be calculated, as shown in Figure 7. Then from Figure 5 or 6, a suitable PCB can be selected.
2001 May 18
16
Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
500 450 THERMAL RESISTANCE (C/W) 400 350 300 250 200 150 100 50 0 50 60 70 80 90 100 110 120 130 Ptot = 453.8 mW (Vbat = 26.5 V, 32 nodes) Ptot = 333.1 mW (Vbat = 26.5 V, 10 nodes) Ptot = 211.5 mW (Vbat = 13.4 V, 32 nodes)
AMBIENT TEMPERATURE (C)
SL01256
Figure 7.
Required Thermal Resistance vs. Ambient Temperature and Power Dissipation
2001 May 18
17
Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
2001 May 18
18
Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
2001 May 18
19
Philips Semiconductors
Product data
Single wire CAN transceiver
AU5790
Data sheet status
Data sheet status [1] Objective data Preliminary data Product status [2] Development Qualification Definitions This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Product data
Production
[1] Please consult the most recently issued datasheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Disclaimers
Life support -- These products are not designed for use in life support appliances, devices or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 2001 All rights reserved. Printed in U.S.A. Date of release: 05-01 Document order number: 9397 750 08401
Philips Semiconductors
2001 May 18 20

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